HG-SC-103 · Semiconductor
Wafer Handling End Effector
ESD PEEK / A6061-T6 · ±0.02 mm · 1 – 100 pcs
HG-SC-103
Wafer Handling End Effector
End effector for 300 mm wafer transfer robots. Thin, long geometry is stabilized between roughing and finishing to prevent warpage.
- Material
- ESD
- Tolerance
- ±0.02 mm
- Lead time
- 2 – 3 weeks
- Vacuum hole position ±0.02 mm
- Surface resistivity 10⁶ – 10⁹ Ω
- Delivered with ceramic pads assembled on request
[SPEC] Specifications
Specifications
Values reflect a representative delivered job. Processes are re-engineered to each customer drawing.
| Part code | HG-SC-103 |
|---|---|
| Industry | Semiconductor |
| Material | ESD PEEK / A6061-T6 |
| Tolerance | ±0.02 mm |
| Geometric / surface | Flatness 0.03 mm / thickness 3.0 ±0.02 mm |
| Size range | For 300 mm wafers, up to 420 mm long |
| Finish | Static-dissipative material, matte blast |
| Order quantity | 1 – 100 pcs |
| Standard lead time | 2 – 3 weeks |
| Documents | CMM report, mill certificate, coating certificate |
Process flow
- Material annealing
- Roughing
- Stabilization (48 h)
- Finishing
- Flatness check
- Vacuum packing
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