02 / Capabilities
Semiconductor, battery, automotive and robotics. Four industries, one standard of precision.
01 / SEMICONDUCTOR
Vacuum chambers, gas manifolds and wafer handling parts for etch, deposition and cleaning tools, delivered leak-tested and clean-packed.
02 / SECONDARY BATTERY
Jigs, guides and housings for notching, stacking and calendering lines, with repeat builds timed to line expansions.
03 / AUTOMOTIVE
EV motor housings, cooling plates and chassis brackets machined from billet for design validation before tooling.
04 / MACHINERY & ROBOTICS
Reducer flanges, linear stage bases and insulator blocks with datum faces and bores held at grinding-level accuracy.
[PROCESS] How we work
One engineering contact manages your project from quotation to shipment, in English.
[EQUIPMENT] Key equipment
As of September 2026. Full list available on the Korean facilities page.
| Machine | Specification | Qty |
|---|---|---|
| MACHINING / Machining | ||
| 5-axis machining center | Table Ø 650 – Ø 800 mm, max X1,000 × Y850 × Z650 | 14 |
| Vertical machining center (3-axis) | X 1,050 – 1,600 mm, 12,000 – 20,000 rpm | 18 |
| CNC turn-mill lathe | Ø 450 × 1,000 mm, Y-axis & sub-spindle | 8 |
| Wire EDM | Max workpiece 800 × 600 × 300 mm | 2 |
| Surface grinder | Table 400 × 1,000 mm, 0.001 mm feed | 3 |
| METROLOGY / Metrology | ||
| Coordinate measuring machine | Up to 1,200 × 1,000 × 800 mm, MPE 1.7 + L/333 μm | 3 |
| Contour & roughness tester | Ra resolution 0.01 μm | 2 |
| Vision measuring system | 400 × 300 mm non-contact | 2 |
| Helium leak detector | Detection limit 5 × 10⁻¹² mbar·L/s | 1 |
PDF, STEP, DWG or IGES. From a single prototype to monthly production volumes.